Frontend
CMOS, BCD, Power and SiC — from 350 nm down to 65 nm.
RifSol Frontend Fab — Morocco
Automated material handling, 24/7 operations — and the teams behind every wafer.
From crystal to 8-inch wafer — silicon and silicon carbide.
Wafer manufacturing under phased deployment
Designed where it's built. Architecture to verification, one team.
CMOS, BCD, Power and SiC — from 350 nm down to 65 nm.
Packaging, test and reliability — the last mile to a qualified chip.
±25 μm placement accuracy on lines that never sleep.
Target >99.9% first-pass yield during ramp
High-density AI compute and colocation, powered by 50% renewable energy.
SiC, GaN and advanced packaging — the next platform is already in the lab.
Integrated technology services connecting every division of the platform.
Strategic Location
Strategically positioned at the crossroads of Europe, Africa and the Americas — with the largest port in Africa at Tangier Med, an international hub in Casablanca, and highway connections into Europe.
Process platforms under phased industrialization — from 350 nm silicon to wide-bandgap programs.