SMT Production Lines
Automated placement and reflow lines for fine-pitch, mixed-technology and power electronics boards.
- SPI before placement
- ±25 μm placement accuracy
- Lead-free reflow profiles
RIFSOL · SMT / PCBA DIVISION
SMT / PCBA Division
Lines that never sleep.
Surface-mount assembly with ±25 μm placement accuracy and a >99.9% first-pass yield target — 24/7, inspected at every station.
±25 μm placement>99.9% FPY targetAOI + X-RayICT & functional test
Overview
Electronics manufacturing under the same roof
The SMT/PCBA division completes the vertical-integration story: chips made at RifSol are mounted onto boards at RifSol. State-of-the-art surface-mount lines handle fine-pitch components, large power packages and mixed-technology boards, with automated solder-paste inspection, precision placement and reflow profiles engineered per product family.
Quality is enforced between every step, not at the end. AOI (Automated Optical Inspection) follows placement and reflow; 3D X-Ray verifies hidden joints under BGAs and power packages; ICT and functional test then prove the assembled board behaves as designed. The manufacturing flow runs from material receipt and incoming QC all the way to final QC and shipping, with each hand-off logged.
The division also assembles what boards go into. Conformal coating protects electronics in harsh environments, while module and box-build integration turns PCAs into complete units — power modules, control cabinets and system-level products. Because the SMT lines run 24/7 under Industry 4.0 monitoring, throughput and first-pass yield are live engineering targets, with predictive maintenance keeping placement machines inside their ±25 μm window.
±25 μm
Placement accuracy
>99.9%
First-pass yield target
24/7
Line operation
3× ISO
9001 · IATF 16949 · 14001
Capabilities
What SMT / PCBA delivers
AOI & X-Ray Inspection
Optical inspection after every critical step plus X-Ray verification of hidden solder joints.
- Post-placement AOI
- Post-reflow AOI
- X-Ray for BGA and power packages
ICT & Functional Test
In-circuit and functional test systems validate each assembly against its specification.
- Flying-probe and bed-of-nails ICT
- Functional bench and rack test
- Boundary-scan coverage
Conformal Coating
Protective coating for boards destined for humidity, dust and vibration environments.
- Selective coating
- UV cure and inspection
- Automotive-grade finishes
Module & Box Build
From bare PCA to complete assembled unit — cabling, sub-assemblies and final integration.
- Module integration
- Cabling and interconnect
- Final assembly and labeling
Smart Factory Systems
Industry 4.0 toolchain: real-time analytics, predictive maintenance and full traceability.
- Line-level OEE dashboards
- Predictive maintenance alerts
- Unit-level traceability
Quality & certifications
Certified processes, auditable data.
The SMT/PCBA lines are engineered to automotive-grade quality systems. Certifications apply to certified processes; deployment follows the phased build-out plan of the platform.
ISO 9001
- Quality management system
- Documented process discipline end to end
- Continuous-improvement loop with line data
IATF 16949
- Automotive quality management
- Defect prevention at every gate: SPI · AOI · X-Ray · ICT
- Traceability and reaction plans per unit
ISO 14001
- Environmental management system
- Lead-free, RoHS-aware assembly processes
- Energy and waste tracking per line
How it works
The flow, step by step
- 01
Material Receipt & Incoming QC
Components and PCBs are verified on arrival against engineering documentation.
- 02
Solder Paste & Placement
Paste is inspected (SPI) before pick-and-place machines position components to ±25 μm.
- 03
Reflow
Controlled thermal profiles form every solder joint in a single pass.
- 04
AOI & X-Ray
Optical inspection plus X-Ray verify joint quality, including hidden BGA connections.
- 05
ICT & Functional Test
In-circuit and functional tests prove electrical and behavioral conformance.
- 06
Final QC & Shipping
Conformal coating, box build and final QC release units for shipment.
Why it matters
First-pass yield is an engineering target, not a hope.
Every quality gate on the line — paste inspection, AOI, X-Ray, ICT — exists to catch a defect at the cheapest possible point. The result the division is engineered to deliver is simple: boards that pass functional test the first time, at a rate above 99.9% during ramp, with the data to prove it unit by unit.
Where it goes
Applications & industries
Power electronics builds
Assemblies carrying the power modules and drivers produced by Backend.
Industrial control units
Controllers, drives and monitoring boards for factory and infrastructure customers.
System products
Box-build integration for complete RifSol power systems and telecom infrastructure.
Work with SMT / PCBA.
From engineering programs to production partnership — the SMT / PCBA team is one message away.